Views: 0 Author: Site Editor Publish Time: 2026-09-10 Origin: Site
From ATE test platforms and package substrates to high-speed connectors and 5G antennas, electrical signals pass through dielectric materials along every segment of the transmission path.
As operating frequencies rise, materials can no longer serve only as structural support and electrical insulation. Dk affects impedance consistency, while Df contributes to dielectric loss. Moisture absorption, thermal deformation, and dimensional drift can further reduce design margins.
As data rates advance from 28G NRZ to 112G PAM4 and operating frequencies extend from 6 GHz to the 77 GHz millimeter-wave band, materials must deliver low loss, hygrothermal stability, heat resistance, and precision moldability at the same time.
In high-speed interconnect design, a single dielectric value is never enough. Materials must also maintain long-term consistency under humidity, heat, and tight dimensional requirements.
The LK Series comprises four grades developed around dielectric performance, heat resistance, density, and structural requirements, providing a clear starting point for preliminary material selection.
Low loss is the foundation of high-speed signal transmission. In real components, however, materials must also withstand humid-heat environments, weight constraints, different temperature requirements, and the processing demands of thin walls, micro-holes, and complex geometries.
The four grades are not simply arranged as higher and lower performance levels. Each grade is designed around a different combination of application requirements.
CHIP TESTING
Test sockets, probe cards, and burn-in sockets must combine low loss, alignment accuracy, and reliable performance at elevated temperatures.
WAFERS & CARRIERS
IC trays, wafer carriers, and automated handling components benefit from lightweight construction, cleanliness, low moisture absorption, and dimensional stability.
HIGH-SPEED INTERCONNECTS
56G/112G PAM4 connectors and miniaturized interfaces place combined demands on Dk, Df, thin-wall molding, and heat resistance.
HIGH-FREQUENCY & INDUSTRIAL
Applications include 5G and satellite communications, as well as industrial components requiring resistance to common cleaning media. Final grade selection should be validated under the actual operating conditions.
The value of a high-frequency interconnect material is not defined by one lower number. It comes from consistent performance throughout the signal path: controlling Dk and Df while also addressing moisture absorption, heat resistance, dimensional accuracy, mechanical properties, and process compatibility.
LK-01, LK-02, LK-03, and LK-04 provide four selection directions, helping designers balance low loss, low thermal expansion, structural rigidity, and high-temperature load-bearing performance according to actual application requirements.
