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| Polyimide rod, long-term use temperature range of -269~300℃, Short-term usage temperature can reach up to 400℃. | |||||||||
JUTAIPI®NA is a Polyimide (PI) profile. This material is made from a robust polyimide substrate and is suitable for demanding applications requiring excellent heat resistance, low wear and friction, strength, and impact resistance.
JUTAIPI®NA possesses properties that help overcome challenges in sealing, friction, and wear. It can withstand high temperatures and endure harsh operating environments in aerospace, transportation, and industrial applications.

Product Features:
Maintains long-term thermal stability at a continuous use temperature of 300°C (with short-term exposure up to 400°C).
High heat resistance, with a maximum
service temperature of up to 470°C (HDT/A).
Good low-temperature performance, effective down to -270°C.
Retains high strength, high modulus, and high stiffness above 260°C.
Outstanding heat resistance and electrical insulation.
Exhibits high purity and low outgassing under vacuum conditions. Good machinability.
Inherent flame retardancy.

JUTAIPI®NA is a Polyimide (PI) profile. This material is made from a robust polyimide substrate and is suitable for demanding applications requiring excellent heat resistance, low wear and friction, strength, and impact resistance.
JUTAIPI®NA possesses properties that help overcome challenges in sealing, friction, and wear. It can withstand high temperatures and endure harsh operating environments in aerospace, transportation, and industrial applications.

Product Features:
Maintains long-term thermal stability at a continuous use temperature of 300°C (with short-term exposure up to 400°C).
High heat resistance, with a maximum
service temperature of up to 470°C (HDT/A).
Good low-temperature performance, effective down to -270°C.
Retains high strength, high modulus, and high stiffness above 260°C.
Outstanding heat resistance and electrical insulation.
Exhibits high purity and low outgassing under vacuum conditions. Good machinability.
Inherent flame retardancy.

Mechanical Engineering
Precision Engineering

Aerospace Technology
Nuclear and Vacuum Technology
Cryogenic Engineering
Electronic and Semiconductor Technology
Electrical Engineering Electronics Industry


Mechanical Engineering
Precision Engineering

Aerospace Technology
Nuclear and Vacuum Technology
Cryogenic Engineering
Electronic and Semiconductor Technology
Electrical Engineering Electronics Industry


Performance | Test Method | Unit | Standard |
Color | Eyes | / | Chestnut or Brown |
Density | GB/T 1033 | g/cm3 | 1.42-1.43 |
Tensile Strength | GB/T 1040 | MPa | ≥85 |
Compressive stress | GB/T 1041 | MPa | ≥138 |
Notched Charpy Impact Strength | GB/T 1041 | kJ/m2 | ≥50 |
Flexural Strength | GB/T 9341 | MPa | ≥130 |
Flexural Modulus | GB/T 9341 | GPa | ≥2.8 |
Heat Deflection Temperature | GB/T 1634 | ℃ | ≥300 |
Thermal Conductivity | GB/T 10295 | W/m.K | ≤0.5 |
Dielectric Strength | GB/T 1408 | Kv/mm | ≥24.5 |
Dielectric Constant(1MHZ) | GB/T 1409 | 1 | 3.29-3.32 |
Dielectric Loss (1MHZ) | GB/T 1409 | 1*10-3 | 3.5-3.7 |
Performance | Test Method | Unit | Standard |
Color | Eyes | / | Chestnut or Brown |
Density | GB/T 1033 | g/cm3 | 1.42-1.43 |
Tensile Strength | GB/T 1040 | MPa | ≥85 |
Compressive stress | GB/T 1041 | MPa | ≥138 |
Notched Charpy Impact Strength | GB/T 1041 | kJ/m2 | ≥50 |
Flexural Strength | GB/T 9341 | MPa | ≥130 |
Flexural Modulus | GB/T 9341 | GPa | ≥2.8 |
Heat Deflection Temperature | GB/T 1634 | ℃ | ≥300 |
Thermal Conductivity | GB/T 10295 | W/m.K | ≤0.5 |
Dielectric Strength | GB/T 1408 | Kv/mm | ≥24.5 |
Dielectric Constant(1MHZ) | GB/T 1409 | 1 | 3.29-3.32 |
Dielectric Loss (1MHZ) | GB/T 1409 | 1*10-3 | 3.5-3.7 |